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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11837476 B1

PDFFull Text
Date of Patent:
Dec. 05, 2023

Filed:

May. 15, 2020

Flip-chip package with reduced underfill area

Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Yazhou Zhang, Shanghai, CN;

Hope Chiu, Shanghai, CN;

Jiandi Du, Shanghai, CN;

Paul Qu, Shanghai, CN;

Assignee:

WESTERN DIGITAL TECHNOLOGIES, INC., San Jose, CA (US);

Attorney:

MORGAN, LEWIS & BOCKIUS LLP

Primary Examiner:

Dale E Page

Assistant Examiner:

Abbigale A Boyle

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 21/4803 (2013.01); H01L 23/24 (2013.01); H01L 24/32 (2013.01); H01L 2224/3224 (2013.01); H01L 2224/73104 (2013.01);
Abstract

A flip-chip package and a method for assembling a flip-chip package includes positioning the die on a substrate and introducing an underfill material into a space between the die and the substrate, where a portion of the underfill material extends beyond an edge of the die and forms a fillet that at least partially surrounds the die. The underfill material is cured, and a portion of the fillet is removed to reduce the area of the fillet.

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Zhang, Yazhou. (2023). Flip-chip package with reduced underfill area (U.S. Patent No. 11837476). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11837476

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