The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Mar. 23, 2017
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventors:
Kunihiro Oda, Ibaraki, JP;
Takayuki Asano, Ibaraki, JP;
Assignee:
JX Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); C22C 1/02 (2006.01); C22C 14/00 (2006.01); C22F 1/00 (2006.01); C22F 1/18 (2006.01); B22D 7/00 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3426 (2013.01); B22D 7/005 (2013.01); C22C 1/02 (2013.01); C22C 14/00 (2013.01); C22F 1/002 (2013.01); C22F 1/183 (2013.01); C23C 14/3414 (2013.01);
Abstract
Provided is a Ti—Nb alloy sputtering target containing 0.1 to 30 at % of Nb, the remainder of Ti and unavoidable impurities; and the Ti—Nb alloy sputtering target is characterized by having an oxygen content of 400 wtppm or less. Since the target in the present disclosure has a favorable surface texture with a low oxygen content and is readily processable due to the low hardness of the target, the Ti—Nb alloy sputtering target yields a superior effect of being able to suppress the generation of particles during sputtering.