The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Oct. 22, 2020
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Kapil Umesh Sawlani, Sunnyvale, CA (US);

Atashi Basu, Menlo Park, CA (US);

David Michael Fried, Monte Sereno, CA (US);

Michal Danek, Cupertino, CA (US);

Emily Ann Alden, Portland, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/3308 (2020.01); G06F 30/337 (2020.01); G06F 30/27 (2020.01);
U.S. Cl.
CPC ...
G06F 30/3308 (2020.01); G06F 30/27 (2020.01); G06F 30/337 (2020.01);
Abstract

Methods, systems, and computer programs are presented for determining the recipe for manufacturing a semiconductor with the use of machine learning (ML) to accelerate the definition of recipes. One general aspect includes a method that includes an operation for performing experiments for processing a component, each experiment controlled by a recipe, from a set of recipes, that identifies parameters for manufacturing equipment. The method further includes an operation for performing virtual simulations for processing the component, each simulation controlled by one recipe from the set of recipes. An ML model is obtained by training an ML algorithm using experiment results and virtual results from the virtual simulations. The method further includes operations for receiving specifications for a desired processing of the component, and creating, by the ML model, a new recipe for processing the component based on the specifications.


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