The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Feb. 12, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Ming Xu, San Jose, CA (US);

Kenneth Le, Fremont, CA (US);

Ashley M. Okada, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 7/06 (2006.01);
U.S. Cl.
CPC ...
G05D 7/0635 (2013.01); G05D 7/0623 (2013.01);
Abstract

A manufacturing system includes a processing chamber, an gas supply, and a mass flow control apparatus coupled to the gas supply and the processing chamber. The mass flow control apparatus includes a flow restriction element configured to restrict a flow rate of a gas, a bypass flow element configured to control the flow rate of the gas in parallel to the flow restriction element, and a pressure regulator configured to control a pressure of the gas between the pressure regulator and the flow restriction element and/or a pressure of the gas between the pressure regulator and the flow restriction element. The manufacturing system further includes a controller that is configured to flow gas from the gas supply to the processing chamber via the mass flow control apparatus in view of a first pressure setting. The controller further determines to modify the flow of the gas from a first flow rate associated with the first pressure setting to a second flow rate. The controller further determines a second pressure setting associated with the second flow rate and causes the pressure regulator to modify the pressure of the gas between the pressure regulator and the flow restriction element and/or the pressure regulator and the bypass flow element in view of the second pressure setting.


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