The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Oct. 15, 2019
Applicant:

Merck Patent Gmbh, Darmstadt, DE;

Inventors:

Gregor Larbig, Gelnhausen, DE;

Pawel Miskiewicz, Neu-Isenburg, DE;

Frank Meyer, Glashuetten, DE;

Joerg Pahnke, Darmstadt, DE;

Karsten Koppe, Darmstadt, DE;

Assignee:

Merck Patent GmbH, Darmstadt, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09K 19/20 (2006.01); C08G 73/10 (2006.01); C08G 77/04 (2006.01); C09K 19/02 (2006.01); C09K 19/34 (2006.01); B82Y 20/00 (2011.01); C09K 19/04 (2006.01);
U.S. Cl.
CPC ...
C09K 19/2028 (2013.01); C08G 73/10 (2013.01); C08G 77/045 (2013.01); C09K 19/02 (2013.01); C09K 19/3483 (2013.01); B82Y 20/00 (2013.01); C08G 2250/00 (2013.01); C09K 2019/0448 (2013.01); C09K 2019/2078 (2013.01); C09K 2219/03 (2013.01);
Abstract

The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.


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