The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Oct. 16, 2020
Applicant:

Hongsheng Technology (Beijing) Co., Ltd, Beijing, CN;

Inventors:

Zhongda Duan, Beijing, CN;

Runda Yan, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 129/04 (2006.01); C08J 3/24 (2006.01); C08K 3/38 (2006.01); C08K 5/092 (2006.01); C09J 103/02 (2006.01); C08K 3/16 (2006.01);
U.S. Cl.
CPC ...
C09J 129/04 (2013.01); C08J 3/24 (2013.01); C08K 3/38 (2013.01); C08K 5/092 (2013.01); C09J 103/02 (2013.01); C08J 2303/02 (2013.01); C08J 2329/04 (2013.01); C08K 2003/162 (2013.01);
Abstract

The present disclosure relates to a modified environment-friendly corn starch adhesive, comprising the following components in parts by weight: 30 parts of corn starch, 300-400 parts of water, 0.2-3 parts of oxidant, and 80-120 parts of polyvinyl alcohol, 1-5 parts of cross-linking agent, 3-5 parts of calcium chloride, 0.1-3 parts of urea, 0.2-0.5 parts of defoamer, and an appropriate amount of sodium hydroxide (to adjust pH), the cross-linking agent is a modified boric acid cross-linking agent prepared by reacting boric acid with epichlorohydrin, water and citric acid at 80-100° C. The surface of the modified boric acid cross-linking agent is bonded with a large number of epoxy groups and carboxyl groups, which can react with the carboxyl and aldehyde groups of the oxidized starch. These reactions can form synergistic effect with boric acid, which together improve the bonding efficiency and improve the adhesive strength of the colloid.


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