The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2023

Filed:

Sep. 22, 2018
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Adekunle Olubummo, Palo Alto, CA (US);

Lihua Zhao, Palo Alto, CA (US);

Aja Hartman, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B29C 64/268 (2017.01); C08K 5/17 (2006.01); C08L 63/00 (2006.01); C08L 77/04 (2006.01); B29K 63/00 (2006.01); B29K 77/00 (2006.01); B29K 105/00 (2006.01); B29K 105/24 (2006.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B29C 64/268 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); C08K 5/17 (2013.01); C08L 63/00 (2013.01); C08L 77/04 (2013.01); B29K 2063/00 (2013.01); B29K 2077/00 (2013.01); B29K 2105/0032 (2013.01); B29K 2105/24 (2013.01);
Abstract

An example of a three-dimensional (3D) printing kit includes a build material composition, an epoxy agent to be applied to at least a portion of the build material composition during 3D printing, and a fusing agent to be applied to the at least the portion of the build material composition during 3D printing. The build material composition includes a polyamide having an amino functional group. The epoxy agent includes an epoxy having an epoxide functional group to react with the amino functional group of the polyamide in the at least the portion. The fusing agent includes an energy absorber.


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