The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Sep. 06, 2019
Applicant:
Bfly Operations, Inc., Guilford, CT (US);
Inventors:
Jonathan M. Rothberg, Miami Beach, FL (US);
Keith G. Fife, Palo Alto, CA (US);
Tyler S. Ralston, Clinton, CT (US);
Gregory L. Charvat, Guilford, CT (US);
Nevada J. Sanchez, Guilford, CT (US);
Assignee:
BFLY Operations, Inc., Guilford, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G10K 1/00 (2006.01); B06B 1/02 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); G10K 11/18 (2006.01); G10K 9/12 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B06B 1/02 (2013.01); B06B 1/0292 (2013.01); B81B 3/0021 (2013.01); B81B 7/0077 (2013.01); B81C 1/00158 (2013.01); G10K 9/12 (2013.01); G10K 11/18 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/015 (2013.01); B81C 2201/013 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0735 (2013.01); B81C 2203/0771 (2013.01);
Abstract
CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.