The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Apr. 14, 2021
Honda Motor Co., Ltd., Tokyo, JP;
Shutang Chen, Livermore, CA (US);
Gugang Chen, Palo Alto, CA (US);
HONDA MOTOR CO., LTD., Tokyo, JP;
Abstract
Aspects of the present disclosure generally relate to copper-containing bimetallic structures, to processes for producing the copper-containing bimetallic structure, and to uses of the copper-containing bimetallic structures as, e.g., catalysts. In an aspect, a process for forming a bimetallic structure is provided. The process includes forming a mixture comprising a first precursor and a second precursor, the first precursor comprising copper, the second precursor comprising a phosphine. The process further includes introducing a third precursor with the mixture to form the bimetallic structure, the third precursor comprising a Group 8-10 metal, the bimetallic structure comprising copper (Cu), the Group 8-10 metal (M), phosphorous (P), and nitrogen (N), the bimetallic structure having the formula (Cu)(M)(P)(N), wherein a molar ratio of a:b is from about 1:99 to about 99:1, and a molar ratio of a:(c+d) is from about 500:1 to about 1:1.