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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11832501 B1

PDFFull Text
Date of Patent:
Nov. 28, 2023

Filed:

Jun. 08, 2021

Display panel

Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Chunyan Li, Beijing, CN;

Chen Xu, Beijing, CN;

Jingquan Wang, Beijing, CN;

Assignee:

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorneys:

Dave Law Group LLC

Raj S. Dave

Primary Examiner:

Sanjiv D Patel

Int. Cl.
CPC ...
H10K 59/80 (2023.01); G06F 3/044 (2006.01); G06F 3/041 (2006.01); H10K 59/131 (2023.01); H10K 59/40 (2023.01);
U.S. Cl.
CPC ...
H10K 59/873 (2023.02); G06F 3/0412 (2013.01); G06F 3/0443 (2019.05); G06F 3/0446 (2019.05); G06F 3/04164 (2019.05); H10K 59/131 (2023.02); H10K 59/40 (2023.02); G06F 2203/04102 (2013.01); G06F 2203/04107 (2013.01); G06F 2203/04111 (2013.01);
Abstract

A display panel is provided. The display panel has a display region and a peripheral region, the peripheral region includes a first peripheral region, a bending region, and a second peripheral region. The display panel includes a base substrate, a driving circuit layer, an organic structure, and an encapsulation layer; the organic structure includes a first organic structure and a second organic structure, the first organic structure is in the first peripheral region, and the second organic structure includes a first portion in the first peripheral region and a second portion in the bending region; the encapsulation layer partially overlaps with the second organic structure, a portion of the encapsulation layer which overlaps with the second organic structure includes a first encapsulation portion and a second encapsulation portion; an average thickness of the first encapsulation portion is greater than an average thickness of the second encapsulation portion.

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