The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Jun. 02, 2020
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Madhusudan Krishnan Iyengar, Foster City, CA (US);

Christopher Gregory Malone, Mountain View, CA (US);

Yuan Li, Sunnyvale, CA (US);

Jorge Padilla, Union City, CA (US);

Woon-Seong Kwon, Santa Clara, CA (US);

Teckgyu Kang, Saratoga, CA (US);

Norman Paul Jouppi, Palo Alto, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); H05K 7/20772 (2013.01); H01L 23/473 (2013.01); H05K 7/20218 (2013.01); H05K 7/20254 (2013.01); H05K 7/20636 (2013.01);
Abstract

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.


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