The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Dec. 17, 2021
Applicant:
Dongwoo Fine-chem Co., Ltd., Iksan-si, KR;
Inventors:
Assignee:
DONGWOO FINE-CHEM CO., LTD., Iksan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 33/62 (2010.01); H05K 1/03 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H01L 33/62 (2013.01); H05K 1/0271 (2013.01); H01L 25/075 (2013.01); H05K 1/0306 (2013.01); H05K 1/111 (2013.01); H05K 1/18 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/0341 (2013.01); H05K 2201/10106 (2013.01);
Abstract
A circuit board includes a base layer, a seed layer formed on the base layer, and a first electrode layer formed on the seed layer. The seed layer is formed of a metal oxide with a thickness of 100 to 400 Å. The circuit board may further include an insulation layer formed on the first electrode layer and a second electrode layer formed on the insulation layer.