The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Nov. 01, 2022
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Thomas Joseph Richardson, South Orange, NJ (US);

Shrinivas Kudekar, Roswell, GA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03M 13/11 (2006.01); H03M 13/00 (2006.01); H03M 13/03 (2006.01); H04L 1/1812 (2023.01); H04L 1/00 (2006.01);
U.S. Cl.
CPC ...
H03M 13/1148 (2013.01); H03M 13/036 (2013.01); H03M 13/116 (2013.01); H03M 13/616 (2013.01); H03M 13/6306 (2013.01); H03M 13/6393 (2013.01); H03M 13/6505 (2013.01); H03M 13/6516 (2013.01); H04L 1/0041 (2013.01); H04L 1/0056 (2013.01); H04L 1/0058 (2013.01); H04L 1/0067 (2013.01); H04L 1/1812 (2013.01); H04L 1/1819 (2013.01);
Abstract

Certain aspects of the present disclosure generally relate to techniques for puncturing of structured low-density parity-check (LDPC) codes. Certain aspects of the present disclosure generally relate to methods and apparatus for a high-performance, flexible, and compact LDPC code. Certain aspects can enable LDPC code designs to support large ranges of rates, blocklengths, and granularity, while being capable of fine incremental redundancy hybrid automatic repeat request (IR-HARD) extension while maintaining good floor performance, a high-level of parallelism to deliver high throughout performance, and a low description complexity.


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