The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Apr. 16, 2021
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventor:

Udo Ausserlechner, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 7/14 (2006.01); G01B 7/30 (2006.01); H01F 5/00 (2006.01); H02K 11/225 (2016.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H02K 3/26 (2006.01); G01D 5/20 (2006.01); G01B 7/00 (2006.01); G01B 7/004 (2006.01);
U.S. Cl.
CPC ...
H02K 11/225 (2016.01); G01D 5/2046 (2013.01); G01D 5/2053 (2013.01); G01D 5/2066 (2013.01); G01D 5/2073 (2013.01); H02K 3/26 (2013.01); H05K 1/0216 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); G01B 7/003 (2013.01); G01B 7/004 (2013.01); H02K 2203/03 (2013.01); H05K 2201/09281 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10492 (2013.01); H05K 2201/10727 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A device includes a substrate with an excitation coil configured to generate a magnetic field in reaction to an input signal fed in, and with a pickup coil arrangement configured to generate an output signal in reaction to a magnetic field. The excitation coil includes one or more turns arranged around the pickup coil arrangement in a ring-shaped manner in a plan view of the substrate plane. The device further includes a chip package comprising at least one electrical connection connected to the pickup coil arrangement by means of a signal-carrying conductor. In accordance with the concept described herein, the chip package is positioned on the substrate in such a way that the signal-carrying conductor and the one or more turns of the excitation coil do not overlap in a plan view of the substrate plane.


Find Patent Forward Citations

Loading…