The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Nov. 12, 2020
Applicant:

Excellence Opto. Inc., Miaoli County, TW;

Inventors:

Kuo-Hsin Huang, Miaoli County, TW;

Yung-Hsiang Chao, Miaoli County, TW;

Wen-Hsing Huang, Miaoli County, TW;

Chang-Ching Huang, Miaoli County, TW;

Tai-Hui Liu, New Taipei, TW;

Assignee:

EXCELLENCE OPTO. INC., Hsinchu Science Park, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); G09G 3/32 (2016.01); H01L 25/16 (2023.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G09G 3/32 (2013.01); H01L 27/0255 (2013.01); H01L 33/62 (2013.01); G09G 2300/0426 (2013.01); G09G 2300/0439 (2013.01); G09G 2320/041 (2013.01); G09G 2330/045 (2013.01);
Abstract

The invention provides a chip structure of a micro light-emitting diode display, comprising a package substrate, at least one light-emitting diode (LED) element, at least one metal oxide semiconductor field effect transistor (MOSFET), and a connection line. The LED element and the MOSFET are positioned on the package substrate, and each MOSFET comprises a source connected with the input voltage in common, a gate connected with a main control circuit, and a drain. An end of the LED element is connected with the drain of the MOSFET through the connection line, and the other end of the LED element is independently connected with a source drive circuit. Therefore, the MOSFET is provided on the package substrate and integrated in a chip structure, so as to achieve a better heat dissipation effect and requirements of high density and brightness.


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