The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Aug. 17, 2021
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Michael Stadler, Munich, DE;
Paul Armand Asentista Calo, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/02245 (2013.01); H01L 2224/02255 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A semiconductor chip includes a chip pad arranged at a surface of the semiconductor chip. A dielectric layer is arranged at the surface of the semiconductor chip. The dielectric layer has an opening within which a contact portion of the chip pad is exposed, the opening having at least one straight side. The dielectric layer includes a solder flux outgassing trench arranged separate from and in the vicinity of the at least one straight side of the opening and that extends laterally beyond sides of the opening adjoining the straight side.