The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Mar. 16, 2021
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Liang Li, Shanghai, CN;

Kevin Hu, Shanghai, CN;

Wendy Yu, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/66 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 22/34 (2013.01);
Abstract

An apparatus for detecting the presence of assembly related defects on a semiconductor device including an edge ring having a resistance value and including one or more layers configured to at least partially cover the semiconductor device in a first direction. The one or more layers are divided into a first section and a second section. Each layer of the one or more layers are in electrical communication with one another. The resistance value of the edge ring is at a first resistance value associated with the first and second sections being intact. At least one of the first section and second section is configured to break in response to an assembly related defect, and the resistance value of the edge ring is configured to change from the first resistance value to a second resistance value in response to at least one of the first and second sections being broken.


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