The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Mar. 15, 2022
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventors:
Ruggero Anzalone, Viagrande, IT;
Nicolo' Frazzetto, San Giovanni la Punta, IT;
Assignee:
STMICROELECTRONICS S.R.L., Agrate Brianza, IT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/16 (2006.01); H01L 21/683 (2006.01); C23C 16/01 (2006.01); C23C 16/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02008 (2013.01); C23C 16/01 (2013.01); C23C 16/325 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02529 (2013.01); H01L 21/6835 (2013.01); H01L 29/1608 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68381 (2013.01);
Abstract
Various embodiments provide an apparatus and method for fabricating a wafer, such as a SiC wafer. The apparatus includes a support having a plurality of arms for supporting a substrate. The arms allows for physical contact between the support and the substrate to be minimized. As a result, when the substrate is melted, surface tension between the arms and molten material is reduced, and the molten material will be less likely to cling to the support.