The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Aug. 12, 2021
Applicant:

Synaptics Incorporated, San Jose, CA (US);

Inventors:

Brett Dunlap, Queen Creek, AZ (US);

Paul Wickboldt, Walnut Creek, CA (US);

Assignee:

Synaptics Incorporated, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G01N 27/22 (2006.01); G06V 40/13 (2022.01); G06F 1/16 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0445 (2019.05); G01N 27/221 (2013.01); G06F 1/1692 (2013.01); G06F 3/0446 (2019.05); G06V 40/1306 (2022.01); G06V 40/1329 (2022.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H05K 1/0298 (2013.01); H05K 1/036 (2013.01); H05K 1/112 (2013.01); H05K 1/145 (2013.01); H05K 1/184 (2013.01); H05K 1/186 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A biometric sensor may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.


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