The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Dec. 29, 2020
Qualcomm Incorporated, San Diego, CA (US);
Yun Du, San Diego, CA (US);
Gang Zhong, San Diego, CA (US);
Fei Wei, San Diego, CA (US);
Yibin Zhang, San Diego, CA (US);
Jing Han, San Jose, CA (US);
Hongjiang Shang, San Diego, CA (US);
Elina Kamenetskaya, Belmont, MA (US);
Minjie Huang, San Diego, CA (US);
Alexei Vladimirovich Bourd, San Diego, CA (US);
Chun Yu, Rancho Santa Fe, CA (US);
Andrew Evan Gruber, Arlington, MA (US);
Eric Demers, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
The present disclosure relates to methods and apparatus for compute processing. For example, disclosed techniques facilitate improving performance of matrix multiplication in streaming processor. Aspects of the present disclosure can execute, with a load control unit, a first load instruction to load a set of input data of an input matrix from a first memory to a second memory. Aspects of the present disclosure can also execute, with the load control unit, a second load instruction to load a set of weight data of a weight matrix from the first memory to the second memory. Additionally, aspects of the present disclosure can perform, with an ALU component, a matrix multiplication operation using the set of input data and the set of weight data to generate an output matrix. Further, aspects of the present disclosure can store the output matrix at a general purpose register accessible to the ALU component.