The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Apr. 20, 2021
Applicant:

Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;

Inventors:

Guangchao Du, Shandong, CN;

Yongzheng Tang, Shandong, CN;

Tao Wu, Shandong, CN;

Jianwei Mu, Shandong, CN;

Shaoshuai Sui, Shandong, CN;

Jihong Han, Shandong, CN;

Sitao Chen, Shandong, CN;

Qian Shao, Shandong, CN;

Bangyu Yu, Shandong, CN;

Benzheng Dong, Shandong, CN;

Xiangxun Sun, Shandong, CN;

Fabu Xu, Shandong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H04B 10/50 (2013.01);
U.S. Cl.
CPC ...
G02B 6/4215 (2013.01); G02B 6/4206 (2013.01); G02B 6/4266 (2013.01); H04B 10/503 (2013.01);
Abstract

An optical module includes an upper shell, a lower shell, a circuit board, a base, a laser assembly and a silicon optical chip. The upper shell and the lower shell form a wrapping cavity. The circuit board is located in the wrapping cavity. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly is located on the base, and is configured to provide light. The silicon optical chip is located on the base, and is configured to receive the light, and modulate the light to convert an electrical signal into an optical signal, and is configured to receive an optical signal from an outside of the optical module and convert the optical signal into an electrical signal.


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