The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Oct. 13, 2022
Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Ravi Vig, Concord, NH (US);

William P. Taylor, Amherst, NH (US);

Andreas P. Friedrich, Metz-Tessy, FR;

Paul A. David, Bow, NH (US);

Marie-Adelaide Lo, Chene-Bougeries, CH;

Eric Burdette, Reddick, FL (US);

Eric G. Shoemaker, Windham, NH (US);

Michael C. Doogue, Bedford, NH (US);

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/14 (2006.01); G01R 33/07 (2006.01); G01R 15/20 (2006.01); G01R 33/00 (2006.01); G01B 7/30 (2006.01);
U.S. Cl.
CPC ...
G01R 33/0047 (2013.01); G01B 7/30 (2013.01); G01D 5/145 (2013.01); G01R 15/202 (2013.01); G01R 33/0011 (2013.01); G01R 33/072 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.


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