The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Aug. 29, 2019
Applicant:

Nvidia Corporation, Santa Clara, CA (US);

Inventors:

Susheela Narasimhan, Fremont, CA (US);

Sanjay Choudhry, Sunnyvale, CA (US);

Assignee:

NVIDIA Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28F 3/08 (2006.01); F28D 1/047 (2006.01); H05K 7/20 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28F 3/086 (2013.01); F28D 1/0475 (2013.01); F28D 15/02 (2013.01); F28D 15/0275 (2013.01); H05K 7/20 (2013.01); F28D 2021/0029 (2013.01); F28F 2215/04 (2013.01);
Abstract

An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.


Find Patent Forward Citations

Loading…