The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Dec. 22, 2021
Applicant:
Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, CN;
Inventors:
Chenyu Shen, Kunshan, CN;
Jue Tan, Kunshan, CN;
Assignee:
ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD., Kunshan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); B32B 27/28 (2006.01); C08G 65/44 (2006.01); C08K 5/3435 (2006.01); C08K 5/3417 (2006.01); C08K 5/529 (2006.01); C08J 5/24 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); C08G 65/44 (2013.01); C08J 5/18 (2013.01); C08J 5/249 (2021.05); C08K 5/3417 (2013.01); C08K 5/3435 (2013.01); C08K 5/529 (2013.01); C08J 2371/12 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2312/02 (2013.01);
Abstract
A resin composition includes: (A) a polyphenylene ether resin of Formula (1) and (B) a compound of Formula (3), and/or a compound of Formula (4), and/or a compound of Formula (5). An article is made from the resin composition. The article made from the resin composition may include a prepreg, a resin film, a laminate or a printed circuit board, and one or more properties including resin filling void, glass transition temperature, Z-axis ratio of thermal expansion, dielectric constant, dissipation factor, and warpage may be improved.