The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Jan. 28, 2019
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Hideki Oka, Nagoya, JP;

Atsuhisa Suzuki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/04 (2006.01); B29C 70/52 (2006.01); C08G 59/50 (2006.01); C08K 3/36 (2006.01); C08J 5/24 (2006.01); B29K 63/00 (2006.01); B29K 307/04 (2006.01); B29K 309/08 (2006.01); B29K 507/04 (2006.01);
U.S. Cl.
CPC ...
C08J 5/043 (2013.01); B29C 70/52 (2013.01); C08G 59/5073 (2013.01); C08J 5/042 (2013.01); C08J 5/048 (2013.01); C08J 5/243 (2021.05); C08J 5/249 (2021.05); C08K 3/36 (2013.01); B29K 2063/00 (2013.01); B29K 2307/04 (2013.01); B29K 2309/08 (2013.01); B29K 2507/04 (2013.01); C08J 2363/00 (2013.01);
Abstract

A fiber-reinforced shaped article in which a reinforcing fiber bundle aggregate formed of a plurality of reinforcing fiber bundles converged is impregnated with an epoxy resin composition and the epoxy resin composition is cured, wherein the epoxy resin composition contains at least components [A], [B], [C], and [D], and a quantity of [A] is 60 to 100 parts by mass per 100 parts by mass of all epoxy resin contained in the epoxy resin composition: [A]: aminophenol type epoxy resin; [B]: two kinds of acid anhydrides of [B1]: acid anhydride having a nadic anhydride structure, and [B2]: acid anhydride having a hydrogenated structure of phthalic anhydride; [C]: at least one filler having a Mohs hardness of 3 or less selected from the group consisting of a silicon compound, a magnesium compound, a calcium compound, an aluminum compound, and inorganic carbon; [D]: a release agent.


Find Patent Forward Citations

Oka, Hideki. (2023). Fiber-reinforced molded article and method of producing same (U.S. Patent No. 11827759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11827759

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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