The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Jul. 20, 2021
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Tao Li, Blue Ash, OH (US);

Timothy P. Coons, Cincinnati, OH (US);

Xi Yang, Alpha, OH (US);

Michael James Weimer, Cincinnati, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 35/573 (2006.01); C04B 35/657 (2006.01); C04B 35/64 (2006.01); B28B 7/34 (2006.01); B32B 18/00 (2006.01); B29C 64/135 (2017.01); C04B 35/80 (2006.01); C04B 35/628 (2006.01); C04B 38/06 (2006.01); B28B 23/00 (2006.01); C04B 38/08 (2006.01); F01D 5/28 (2006.01); C04B 35/571 (2006.01); C04B 35/515 (2006.01); C23C 16/04 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
C04B 35/573 (2013.01); B28B 7/342 (2013.01); B28B 23/0006 (2013.01); B32B 18/00 (2013.01); C04B 35/515 (2013.01); C04B 35/571 (2013.01); C04B 35/62844 (2013.01); C04B 35/62873 (2013.01); C04B 35/62884 (2013.01); C04B 35/62886 (2013.01); C04B 35/64 (2013.01); C04B 35/657 (2013.01); C04B 35/80 (2013.01); C04B 38/06 (2013.01); C04B 38/08 (2013.01); F01D 5/282 (2013.01); B29C 64/135 (2017.08); B33Y 80/00 (2014.12); C04B 2235/422 (2013.01); C04B 2235/5216 (2013.01); C04B 2235/5244 (2013.01); C04B 2235/6028 (2013.01); C04B 2235/614 (2013.01); C04B 2235/616 (2013.01); C04B 2237/365 (2013.01); C04B 2237/38 (2013.01); C04B 2237/62 (2013.01); C23C 16/045 (2013.01); F05D 2300/211 (2013.01); F05D 2300/6012 (2013.01); F05D 2300/6033 (2013.01);
Abstract

The present disclosure relates to a method of fabricating a ceramic composite components. The method may include providing at least a first layer of reinforcing fiber material which may be a pre-impregnated fiber. An additively manufactured component may be provided on or near the first layer. A second layer of reinforcing fiber, which may be a pre-impregnated fiber may be formed on top the additively manufactured component. A precursor is densified to consolidates at least the first and second layer into a densified composite, wherein the additively manufactured material defines at least one cooling passage in the densified composite component.


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