The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Feb. 06, 2019
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Chien-Hua Chen, Corvallis, OR (US);
Christopher A. Leonard, Corvallis, OR (US);
Anthony M. Fuller, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/045 (2006.01); B29C 45/14 (2006.01); B29C 45/00 (2006.01); B29L 31/00 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1637 (2013.01); B29C 45/0046 (2013.01); B29C 45/14639 (2013.01); B41J 2/04501 (2013.01); B29L 2031/7678 (2013.01); B41J 2002/14362 (2013.01); B41J 2202/01 (2013.01);
Abstract
A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.