The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2023

Filed:

Dec. 01, 2021
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yusuke Hashimoto, Kanagawa, JP;

Junichiro Iri, Kanagawa, JP;

Hiroaki Kusano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14072 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/18 (2013.01);
Abstract

A liquid ejection head includes a recording element substrate. The recording element substrate includes a recording element, a circuit wiring driving the recording element to eject liquid, a protective film, an electrode area, a plating bump, and a resin film having elastic properties. The electrode area electrically connects the circuit wiring to an external circuit through an opening in the protective film. The protective film covers the circuit wiring in an outer adjacent region to the opening to define a step in the protective film. The protective film protects the circuit wiring against the liquid. The plating bump is electrically connected to the electrode area. The resin film covers the step and extends from an inner peripheral region of the opening onto the protective film beyond an edge of the opening. The plating bump includes a part projecting from the electrode area onto an upper surface of the resin film.


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