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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11825702 B1

PDFFull Text
Date of Patent:
Nov. 21, 2023

Filed:

Apr. 15, 2021

Display device including a display panel including corner portions having cut patterns defined by cut portions and method of fabricating the same

Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Chang Yeong Song, Suwon-si, KR;

Jong Woo Kim, Hwaseong-si, KR;

Yong Chan Ju, Yongin-si, KR;

Jae Heung Ha, Suwon-si, KR;

Won Jong Kim, Suwon-si, KR;

Hee Yeon Park, Seoul, KR;

Hye In Yang, Siheung-si, KR;

Woo Suk Jung, Yongin-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:

CANTOR COLBURN LLP

Primary Examiner:

Caleb E Henry

Int. Cl.
CPC ...
H10K 59/124 (2023.01); H10K 50/844 (2023.01); H10K 59/122 (2023.01); H10K 71/00 (2023.01); H10K 59/40 (2023.01); H10K 59/12 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/124 (2023.02); H10K 50/844 (2023.02); H10K 59/122 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02); H10K 59/40 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02);
Abstract

An embodiment of the invention provides a display device including a display panel including corner portions having cut patterns defined by cut portions. The display panel includes a substrate, a light-emitting element including a pixel electrode, an emissive layer and a common electrode and disposed on the substrate in the cut pattern, a first inorganic encapsulation layer disposed on the common electrode in the cut pattern; an organic encapsulation layer disposed on the first inorganic encapsulation layer in the cut pattern; and an organic pattern disposed on the substrate in the cut portions.

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