The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Sep. 14, 2018
Applicant:
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Hongfei Cheng, Beijing, CN;
Yuxin Zhang, Beijing, CN;
Assignee:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H10K 59/121 (2023.01); H10K 59/124 (2023.01); H10K 59/126 (2023.01); H10K 71/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/1213 (2023.02); H10K 59/124 (2023.02); H10K 59/126 (2023.02); H10K 71/00 (2023.02);
Abstract
The present disclosure relates to an array substrate and a method for manufacturing the same. The array substrate includes a substrate, a thin film transistor located on the substrate, a light emitting device located on the substrate and spaced apart from the thin film transistor in a direction parallel to a surface of the substrate, and a light shielding portion located between the thin film transistor and the light emitting device for shielding a light from the light emitting device. The light shielding portion surrounds the light emitting layer.