The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Apr. 18, 2022
Applicant:
Novaled Gmbh, Dresden, DE;
Inventors:
Ulrich Heggemann, Dresden, DE;
Markus Hummert, Dresden, DE;
Thomas Rosenow, Dresden, DE;
Mauro Furno, Dresden, DE;
Assignee:
Novaled GmbH, Dresden, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/155 (2023.01); C07F 3/02 (2006.01); C07F 3/06 (2006.01); C07F 5/02 (2006.01); C09K 11/06 (2006.01); H10K 50/17 (2023.01); H10K 59/35 (2023.01); H10K 71/00 (2023.01); H10K 71/30 (2023.01); H10K 85/30 (2023.01); H10K 85/60 (2023.01); H10K 30/30 (2023.01); H10K 50/11 (2023.01); H10K 50/16 (2023.01); H10K 50/18 (2023.01); H10K 50/165 (2023.01); H10K 71/16 (2023.01); H10K 102/10 (2023.01);
U.S. Cl.
CPC ...
H10K 50/155 (2023.02); C07F 3/02 (2013.01); C07F 3/06 (2013.01); C07F 5/022 (2013.01); C09K 11/06 (2013.01); H10K 50/171 (2023.02); H10K 59/35 (2023.02); H10K 71/00 (2023.02); H10K 71/30 (2023.02); H10K 85/30 (2023.02); H10K 85/322 (2023.02); H10K 85/341 (2023.02); H10K 85/381 (2023.02); H10K 85/60 (2023.02); H10K 85/622 (2023.02); H10K 85/633 (2023.02); H10K 85/636 (2023.02); H10K 85/657 (2023.02); H10K 85/6572 (2023.02); C09K 2211/1018 (2013.01); H10K 30/30 (2023.02); H10K 50/11 (2023.02); H10K 50/16 (2023.02); H10K 50/165 (2023.02); H10K 50/17 (2023.02); H10K 50/18 (2023.02); H10K 71/164 (2023.02); H10K 85/615 (2023.02); H10K 2102/103 (2023.02);
Abstract
Compounds, including metal borate compounds, and electronic semiconducting devices including one or more of the compounds. Compounds may be used in a hole transport layer of the electronic semiconducting devices. Display devices, which may include a plurality of OLED pixels. The OLED pixels may include one or more compounds, including metal borate compounds.