The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Aug. 19, 2020
Applicant:

Baidu Usa Llc, Sunnyvale, CA (US);

Inventors:

Shuai Shao, Sunnyvale, CA (US);

Tianyi Gao, Sunnyvale, CA (US);

Assignee:

BAIDU USA LLC, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 35/02 (2006.01); H10N 10/80 (2023.01);
U.S. Cl.
CPC ...
H05K 7/20254 (2013.01); H05K 7/20409 (2013.01); H05K 7/20636 (2013.01); H10N 10/80 (2023.02); H05K 7/20781 (2013.01);
Abstract

According to one embodiment, a hybrid cooling system includes a cold plate that is arranged to mount on an IT component that is mounted on a piece of IT equipment, the cold plate is arranged to receive coolant via a supply line and to return warmed coolant via a return line, the warmed coolant is produced by the cold plate when the cold plate is in contact with the IT component and heat generated by the IT component is transferred into the coolant by the cold plate; a TEC element that is arranged to couple to the IT component; and a heat sink that includes a base that is arranged to couple to the TEC element and one or more fins, the TEC element is configured to transfer at least a portion of the heat generated by the IT component into the one or more fins of the heat sink.


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