The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Mar. 09, 2021
National Technology & Engineering Solutions of Sandia, Llc, Albuquerque, NM (US);
Unm Rainforest Innovations, Albuquerque, NM (US);
Judith Maria Lavin, Albuquerque, NM (US);
Lok-Kun Tsui, Albuquerque, NM (US);
National Technology & Engineering Solutions of Sandia, LLC, Albuquerque, NM (US);
UNM Rainforest Innovations, Albuquerque, NM (US);
Abstract
Highly conductive electrical traces formed over mechanical steps or on non-planar surfaces with linewidths of 10 to 100 μm and a method for forming such electrical traces are disclosed. The method employs two steps, with the first step using an aerosol jet printing (AJP) process to form thin electrical traces that serve as the seed layers for the second step. The first step preferably employs multiple passes with the AJP to create multiple seed sub-layers with improved continuity and conductivity. In the second step, the seed layers are subjected to an electrodeposition process that forms the bulk of the thickness of the electrical traces. The electrodeposition process may include one, two, or three phases at corresponding low or high biases, with low biases providing denser, more highly conductive plating sub-layers, while high biases provide plating sub-layers having better gap bridging properties.