logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11825599 B1

PDFFull Text
Date of Patent:
Nov. 21, 2023

Filed:

Oct. 13, 2021

Air-pocket prevention pcb, air-pocket prevention pcb module, electrical device including the same, and manufacturing method of electrical device including the same

Applicant:

Solum Co., Ltd., Gyeonggi-Do, KR;

Inventors:

Jun Kyu Lee, Gyeonggi-do, KR;

Jeong Man Han, Gyeonggi-do, KR;

Su Young Kim, Gyeonggi-Do, KR;

Yong Woo Kang, Gyeonggi-Do, KR;

Sang Keun Ji, Gyeonggi-Do, KR;

Dong Kyun Ryu, Seoul, KR;

Assignee:

SOLUM CO., LTD., Gyeonggi-Do, KR;

Attorney:

Ladas & Parry, LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 5/02 (2006.01); H05K 7/00 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 23/04 (2006.01); H01L 23/053 (2006.01); H01L 23/055 (2006.01); H01L 23/18 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01); H01M 10/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0272 (2013.01); H05K 3/34 (2013.01); H05K 2201/09063 (2013.01);
Abstract

The present invention relates to an electrical device including a printed circuit board (PCB) accommodated in a case, and more particularly, to an air-pocket prevention PCB, an air-pocket prevention PCB module, an electrical device including the same, and a manufacturing method of an electrical device including the same with improved fluidity of a resin material so that air pockets that may occur when the case is filled with the resin material are easily discharged and the resin material may be evenly filled inside the case.

Find Patent Forward Citations

Loading…