The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Mar. 23, 2022
Applicant:

Aptiv Technologies Limited, St. Michael, BB;

Inventors:

Navneet Gupta, Karnataka, IN;

Kesav Kumar Sridharan, Bengaluru, IN;

Scott Brandenburg, Kokomo, IN (US);

Assignee:

Aptiv Technologies Limited, St. Michael, BB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 7/20 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H05K 7/20154 (2013.01); H01L 23/49816 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls.


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