The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Aug. 26, 2020
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Yushi Sato, Kawasaki, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/00 (2006.01); H05K 7/20 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); G01K 7/22 (2006.01); G01R 31/52 (2020.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); G01K 7/22 (2013.01); G01R 31/52 (2020.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H05K 1/0204 (2013.01); H05K 1/142 (2013.01); H05K 1/18 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A semiconductor module, including a cooler having first and second flow passages respectively formed on first and second sides of the semiconductor module that are opposite to each other, and a third flow passage connecting the first and second flow passages. The semiconductor module further includes a laminated substrate disposed on the cooler and having first to third circuit boards, a first sensing chip having a sensing function for detecting a temperature and a first non-sensing chip not having the sensing function, disposed on the first circuit board side by side along the third flow passage, and a second sensing chip having the sensing function and a second non-sensing chip not having the sensing function, disposed on the third circuit board side by side along the third flow passage. The first and second sensing chips are respectively disposed on the second side and the first side of the semiconductor module.


Find Patent Forward Citations

Loading…