The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Nov. 25, 2019
Applicant:

Nlight, Inc., Vancouver, WA (US);

Inventor:

Manoj Kanskar, Portland, OR (US);

Assignee:

nLIGHT, Inc., Camas, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/028 (2006.01); H01S 5/40 (2006.01); H01S 5/02251 (2021.01); H01S 5/02253 (2021.01); H01S 5/02255 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02423 (2013.01); H01S 5/0287 (2013.01); H01S 5/02251 (2021.01); H01S 5/02253 (2021.01); H01S 5/02255 (2021.01); H01S 5/4025 (2013.01); H01S 5/4012 (2013.01); H01S 5/4075 (2013.01); H01S 5/4081 (2013.01);
Abstract

The disclosed diode laser packages include a carrier having an optics-mounting surface to which first and second sets of collimating and turning optics are mounted. The carrier includes a heatsink receptacle medially located between the first and second sets. A cooling plenum has a diode-mounting surface and includes heatsink material disposed in the heatsink receptacle. The cooling plenum further has an inlet, an outlet, and a coolant passageway defined between the inlet and the outlet. The coolant passageway is sized to receive the heatsink material disposed in heatsink receptacle. Multiple semiconductor laser diode devices are each mounted atop the diode-mounting surface and positioned for bidirectional emission toward the first and second sets of collimating and turning optics. The multiple semiconductor laser diode devices are thermally coupled to the heatsink material through which coolant is deliverable by the coolant passageway.


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