The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Sep. 25, 2019
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventors:
Yoshitaka Yoshino, Kanagawa, JP;
Toshiyuki Sudo, Kanagawa, JP;
Assignee:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/50 (2006.01); H01R 24/40 (2011.01); H01R 24/60 (2011.01); H01R 13/646 (2011.01); H01R 103/00 (2006.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/50 (2013.01); H01R 24/40 (2013.01); H01R 24/60 (2013.01); H01R 13/646 (2013.01); H01R 2103/00 (2013.01); H01R 2107/00 (2013.01);
Abstract
A connector includes a cable including at least one core wire and a shielding wire arranged around the core wire with an insulating member interposed therebetween, a plug part connected to the cable and capable of fitting with a receptacle, a primary molded part including a connection portion between the core wire and a conductive member of the plug part, and a secondary molded part arranged at a lead-out portion of the cable. The dimension of the primary molded part is an outer diameter or a thickness of the plug part.