The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Sep. 20, 2018
Applicant:

Nexgen Materials, Llc, Sandy, UT (US);

Inventors:

Alexander A. Bistrika, Corvallis, OR (US);

Jacob Donovan Tenhoff, San Francisco, CA (US);

Erica Viola Lewis, Portland, OR (US);

Jordan Loos, Springfield, OR (US);

Gerard W. Kesselring, West Linn, OR (US);

Bill Jay Brooks, Lebanon, OR (US);

Assignee:

NEXGEN Materials, LLC, Sandy, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 8/0228 (2016.01); C23F 17/00 (2006.01); C25D 5/48 (2006.01); C25D 5/54 (2006.01); F28F 21/02 (2006.01); H01L 23/373 (2006.01); H01M 8/0206 (2016.01); H01M 8/0232 (2016.01); H01M 8/0245 (2016.01); H01M 8/18 (2006.01); C25D 5/00 (2006.01); H01M 8/0226 (2016.01); H01M 8/10 (2016.01);
U.S. Cl.
CPC ...
H01M 8/0228 (2013.01); C23F 17/00 (2013.01); C25D 5/48 (2013.01); C25D 5/54 (2013.01); C25D 5/605 (2020.08); F28F 21/02 (2013.01); H01L 23/3736 (2013.01); H01M 8/0206 (2013.01); H01M 8/0226 (2013.01); H01M 8/0232 (2013.01); H01M 8/0245 (2013.01); H01M 8/188 (2013.01); H01M 2008/1095 (2013.01);
Abstract

The present invention includes methods of manufacturing a metal infused graphitic material. Also described is how this device may be rendered impermeable. The present invention includes the electroplating/electroless deposition of metal on exposed internal and external surfaces of a porous graphitic substrate. The deposition of metal on the internal structure is accomplished by replacing the void space in the porous substrate with an electrolyte solution containing dissolved metallic species. The plating is initiated either through electrochemical means, electroless means, chemical vapor deposition means, or other means obvious to one familiar in the art of metal plating. A post-deposition bath is also described wherein the plating may be removed from one or both sides of the external surface without impacting the internal pore plating.


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