The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Jan. 17, 2022
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Takashi Yoshimura, Matsumoto, JP;

Yuichi Onozawa, Matsumoto, JP;

Hiroshi Takishita, Matsumoto, JP;

Misaki Meguro, Matsumoto, JP;

Motoyoshi Kubouchi, Matsumoto, JP;

Naoko Kodama, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/36 (2006.01); H01L 21/22 (2006.01); H01L 21/265 (2006.01); H01L 21/322 (2006.01); H01L 29/06 (2006.01); H01L 29/12 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 29/36 (2013.01); H01L 21/22 (2013.01); H01L 21/265 (2013.01); H01L 21/322 (2013.01); H01L 29/06 (2013.01); H01L 29/12 (2013.01); H01L 29/739 (2013.01); H01L 29/78 (2013.01); H01L 29/861 (2013.01);
Abstract

Provided is a semiconductor device including a semiconductor substrate; a hydrogen donor that is provide inside the semiconductor substrate in a depth direction, has a doping concentration that is higher than a doping concentration of a dopant of the semiconductor substrate, has a doping concentration distribution peak at a first position that is a predetermined distance in the depth direction of the semiconductor substrate away from one main surface of the semiconductor substrate, and has a tail of the doping concentration distribution where the doping concentration is lower than at the peak, farther on the one main surface side than where the first position is located; and a crystalline defect region having a crystalline defect density center peak at a position shallower than the first position, in the depth direction of the semiconductor substrate.


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