The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Apr. 29, 2022
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventor:

Chih-Wei Huang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/008 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/75 (2013.01); H01G 4/008 (2013.01); H01L 23/5222 (2013.01);
Abstract

The present application discloses a method for fabricating a semiconductor device with capacitors having a shared electrode. The method includes providing a substrate, forming a first trench in the substrate, doping sidewalls and a bottom surface of the first trench to form a bottom conductive structure, forming a first insulating layer on the bottom conductive structure and in the first trench, forming a shared conductive layer on the first insulating layer, forming a second insulating layer on the shared conductive layer, forming a top conductive layer on the second insulating layer, and forming a connection structure electrically connecting the bottom conductive structure and the top conductive layer. The bottom conductive structure, the first insulating layer, and the shared conductive layer together configure a first capacitor unit. The shared conductive layer, the second insulating layer, and the top conductive layer together configure a second capacitor unit.


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