The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Jun. 07, 2021
Applicant:

Teledyne Flir, Llc, Thousand Oaks, CA (US);

Inventors:

Eric A. Kurth, Santa Barbara, CA (US);

Marin Sigurdson, Goleta, CA (US);

Robert F. Cannata, Santa Barbara, CA (US);

James L. Dale, Santa Barbara, CA (US);

Christopher Chan, Goleta, CA (US);

Assignee:

Teledyne FLIR, LLC, Thousand Oaks, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G01J 5/02 (2022.01); G01J 5/24 (2006.01); H04N 25/75 (2023.01); G01J 5/00 (2022.01); G01J 5/20 (2006.01); H04N 5/33 (2023.01);
U.S. Cl.
CPC ...
H01L 27/14669 (2013.01); G01J 5/023 (2013.01); G01J 5/024 (2013.01); G01J 5/20 (2013.01); G01J 5/24 (2013.01); H01L 27/14636 (2013.01); H01L 27/14649 (2013.01); H01L 27/14683 (2013.01); H04N 5/33 (2013.01); H04N 25/75 (2023.01); G01J 2005/0077 (2013.01); G01J 2005/202 (2013.01);
Abstract

Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a second having a first dimension that extends in a first direction substantially parallel to the plane and a second dimension that extends in a second direction away from the plane. The first dimension is less than the second dimension. The segment includes a metal layer and a layer formed on a side of the metal layer.


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