The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Sep. 09, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Junghwan Kim, Hwaseong-si, KR;
Sangcheon Park, Hwaseong-si, KR;
Abstract
A semiconductor package includes a first, second, third and fourth semiconductor chips sequentially stacked on one another. The second semiconductor chip includes a second substrate and a second substrate recess formed in an edge of a backside surface of the second substrate. The third semiconductor chip includes a third substrate and a first metal residual material provided in a peripheral region of a front surface of the third substrate. When the second semiconductor chip and the third semiconductor chip are bonded to each other such that the front surface of the third substrate and the backside surface of the second substrate face each other, the first metal residual material is located in the second substrate recess. A first bonding pad on the backside surface of the second substrate and a second bonding pad on the front surface of the third substrate are bonded to each other.