The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Dec. 06, 2019
Applicant:
Preferred Networks, Inc., Tokyo, JP;
Inventor:
Nobuyoshi Tanaka, Tokyo, JP;
Assignee:
Preferred Networks, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 23/06 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/00 (2006.01); G06F 11/10 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); G06F 11/1068 (2013.01); H01L 23/06 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01); H01L 23/433 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/17179 (2013.01);
Abstract
A semiconductor device includes a first chip, a second chip, a third chip, a fourth chip, and a substrate. The first to fourth chips are mounted on the substrate. The first chip is placed adjacent to the second chip and the fourth chip. The third chip is placed adjacent to the second chip and the fourth chip at a position different from that of the first chip. The second chip has a first transferring circuit that transfers data from the first chip to the third chip, and the fourth chip has a second transferring circuit that transfers data from the third chip to the first chip.