The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Sep. 17, 2021
Applicant:
Ampleon Netherlands B.v., Nijmegen, NL;
Inventor:
Leonardus Theodorus Maria Raben, Nijmegen, NL;
Assignee:
Ampleon Netherlands B.V., Nijmegen, NL;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49555 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 23/49861 (2013.01); H01L 23/3121 (2013.01); H01L 23/49568 (2013.01); H01L 24/48 (2013.01); H01L 2224/48245 (2013.01);
Abstract
The present disclosure relates to a molded radiofrequency, 'RF', power package. The present disclosure further relates to a method for manufacturing such package. According to example embodiments, weakening structures are provided in the leads to allow the leads to be bent without causing delamination in the body of solidified molding compound.