The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Nov. 29, 2019
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Kyohei Yamashita, Kyoto, JP;
Yoshihiro Hosoi, Kyoto, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H01L 23/14 (2006.01); H05K 3/38 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/14 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 3/388 (2013.01); H05K 1/03 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01); H05K 2201/09036 (2013.01);
Abstract
A wiring substrate includes an insulating substrate, a conductor layer and an interlayer. The insulating substrate contains AlN. The conductor layer contains Cu. The interlayer is located between the insulating substrate and the conductor layer. In the interlayer, between a first region near the insulating substrate and a second region near the conductor layer, Cu concentration is higher in the second region than in the first region, and Al concentration is higher in the first region than in the second region.