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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11822243 B1

PDFFull Text
Date of Patent:
Nov. 21, 2023

Filed:

Aug. 22, 2017

Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yugo Tanigaki, Otsu, JP;

Akihiro Ishikawa, Otsu, JP;

Kazuto Miyoshi, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/037 (2006.01); G03F 7/30 (2006.01); G03F 7/40 (2006.01); G03F 7/027 (2006.01); G02F 1/1335 (2006.01); G02F 1/1339 (2006.01); G03F 7/023 (2006.01); G03F 7/032 (2006.01); G03F 7/038 (2006.01); G03F 7/075 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); C08F 20/28 (2006.01); H05B 33/22 (2006.01); H05B 33/10 (2006.01); H05B 33/12 (2006.01); G03F 7/105 (2006.01); G03F 7/033 (2006.01); H10K 50/00 (2023.01); H10K 50/86 (2023.01); H10K 59/122 (2023.01); H10K 59/126 (2023.01); H10K 85/40 (2023.01); H10K 85/10 (2023.01); H10K 59/12 (2023.01);
U.S. Cl.
CPC ...
G03F 7/037 (2013.01); C08F 20/28 (2013.01); G02F 1/1335 (2013.01); G02F 1/1339 (2013.01); G02F 1/13394 (2013.01); G02F 1/133512 (2013.01); G03F 7/027 (2013.01); G03F 7/0233 (2013.01); G03F 7/032 (2013.01); G03F 7/033 (2013.01); G03F 7/038 (2013.01); G03F 7/0757 (2013.01); G03F 7/105 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/322 (2013.01); G03F 7/40 (2013.01); H05B 33/10 (2013.01); H05B 33/12 (2013.01); H05B 33/22 (2013.01); H10K 50/00 (2023.02); H10K 50/865 (2023.02); H10K 59/122 (2023.02); H10K 59/126 (2023.02); H10K 85/111 (2023.02); H10K 85/141 (2023.02); H10K 85/40 (2023.02); G02F 1/13398 (2021.01); H10K 59/1201 (2023.02);
Abstract

The present invention provides a negative-type photosensitive resin composition capable of obtaining a cured film suppressing generation of development residues caused by a pigment and having high sensitivity and excellent heat resistance and light blocking capability. A negative-type photosensitive resin composition contains an alkali-soluble resin (A), a radical-polymerizable compound (B), a photopolymerization initiator (C1), and a pigment (D1). In this resin composition, the radical-polymerizable compound (B) contains a flexible chain-containing radical-polymerizable compound (B1), the flexible chain-containing radical-polymerizable compound (B1) contains a compound having (I) a structure derived from a compound having at least three hydroxyl groups in the molecule, (II) at least three ethylenically unsaturated double bond groups, and (III) at least one aliphatic chain, the aliphatic chain has an average molecular weight of 40 to 500, and the content of the pigment (D1) is 5 to 70 mass % of the total solid content.

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