The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2023

Filed:

Mar. 09, 2021
Applicant:

E Ink Holdings Inc., Hsinchu, TW;

Inventors:

Jen-Shiun Huang, Hsinchu, TW;

Huang-Kai Shen, New Taipei, TW;

Ko-Fan Tu, Hsinchu, TW;

Assignee:

E INK HOLDINGS INC., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1679 (2019.01); G02F 1/1685 (2019.01); G02F 1/167 (2019.01);
U.S. Cl.
CPC ...
G02F 1/1679 (2019.01); G02F 1/167 (2013.01); G02F 1/1685 (2019.01);
Abstract

An electronic paper package structure, including a substrate, an electronic ink layer, a cover plate, a water vapor barrier film and an adhesive layer, is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer. The water vapor barrier film covers the substrate and the electronic ink layer. The adhesive layer is directly bonded between the cover plate and the water vapor barrier film to seal the substrate and the electronic ink layer. The adhesive layer is not bonded between the cover plate and the electronic ink layer.


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