The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Oct. 08, 2021
Applicant:
Avicenatech Corp., Sunnyvale, CA (US);
Inventors:
Robert Kalman, Mountain View, CA (US);
Bardia Pezeshki, Mountain View, CA (US);
Cameron Danesh, Mountain View, CA (US);
Alexander Tselikov, Mountain View, CA (US);
Assignee:
AvicenaTech Corp., Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/43 (2006.01); G02B 6/42 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
G02B 6/43 (2013.01); G02B 6/4214 (2013.01); H01L 25/167 (2013.01); G02B 6/4246 (2013.01);
Abstract
Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.