The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Oct. 06, 2021
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 13/02 (2006.01); H01Q 15/14 (2006.01); G01S 7/03 (2006.01); H01Q 1/38 (2006.01); H01Q 1/32 (2006.01); H01Q 1/52 (2006.01); G01S 13/931 (2020.01); H01Q 1/22 (2006.01); H01Q 17/00 (2006.01); H01L 23/12 (2006.01); H01L 23/28 (2006.01); H01Q 1/24 (2006.01); H05K 1/02 (2006.01); G01S 7/02 (2006.01);
U.S. Cl.
CPC ...
G01S 13/02 (2013.01); G01S 7/03 (2013.01); G01S 13/931 (2013.01); H01L 23/12 (2013.01); H01L 23/28 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/245 (2013.01); H01Q 1/3233 (2013.01); H01Q 1/38 (2013.01); H01Q 1/525 (2013.01); H01Q 15/14 (2013.01); H01Q 17/001 (2013.01); H05K 1/0213 (2013.01); G01S 7/027 (2021.05); G01S 7/028 (2021.05);
Abstract
A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.